- Associate Professor
- Mechanical, Industrial & Systems Engineering
- 401.874.9292
- dmmeyer@uri.edu
- Office Location: Fascitelli Center for Advanced Engineering 308
- Lab: Thermomechanics Laboratory
Recent Publications1
Citation | Journal Impact Factor |
---|---|
Meyer DML, Ensign A. Tornado-strength winds interacting with a highway overpass. Physics of Fluids, 2021; 33(10), 107116. doi: 10.1063/5.0065233 | 2021 JIF 4.871 |
Turner GA, Meyer D. Lead-Free Solder Pull-Off Stress Comparison of a Novel Bump Pull Method with Conventional Hot/Cold Bump Pull Methods. Research and Development in Material Science, 2018; 6(5), 1-8. doi: 10.31031/RDMS.2018.06.000648 | — |
Gemmell KD, Meyer D. Wear of Ultra High Molecular Weight Polyethylene Against Synthetic Sapphire as Bearing Coating for Total Joint Replacements. Research and Development in Material Science, 2018. doi: 10.31031/RDMS.2018.06.000632 | — |
Kolossa R, Abolmaaty A, Meyer DML, Zhang Z. An Inexpensive Microfluidic PDMS Chip for Visual Detection of Biofilm-forming Bacteria. Annual Research & Review in Biology, 2018; 22(3), 1-13. | 2020 JIF 0, 2018 JIF 0.447 |
Zhang Z, Liu C, Meyer DML, Zhang W, Zheng Y. Streaming and Phase-Change Material Microcapsules-Based Mini/Micro Heat Spreader. Journal of Thermal Science and Engineering Applications, 2017; 9(2), 021002. doi: 10.1115/1.4034915 | 2020 JIF 1.270, 2017 JIF 1.170 |
Abolmaaty A, Meyer DML. PDMS Flow Cell for Monitoring Bacterial Adhesion Capacity of Escherichia coli O157:H7 in Beverages. Journal of Advances in Biology & Biotechnology, 2017; 15(4), 1-12. doi: 10.9734/JABB/2017/37682 | — |
Ponte DC, Meyer DML. Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts. Journal of Tribology, 2016; 138(3), 031604. doi: 10.1115/1.4032523 | 2020 JIF 1.967, 2016 JIF 1.815 |
Ponte DC, Meyer DML. Energy Dissipation and Constitutive Modeling for a Mechanistic Description of Pad Scratching in Chemical–Mechanical Planarization. Journal of Materials Science: Materials in Electronics, 2016; 27(2), 1745-1757. doi: 10.1007/s10854-015-3949-4 | 2020 JIF 2.376, 2016 JIF 1.998 |
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